Samsung is working on a semiconductor component that promises to revolutionize the graphic industry with superior performance and data speeds. The said Samsung chip is the industry’s first 4GB DRAM package that will utilize the Second Generation High Bandwidth Memory (HBM2) Interface.
Samsung has announced that the mass production of this Samsung chip will take place soon. This DRAM is reportedly 7 times faster than the current generation DRAM used in the GPU and various other chips. What this basically means is that the graphics in various applications will now improve drastically enabling faster parallel computing and machine learning.
The new DRAM packages will produce a Samsung chip that will be capable of 256GBps bandwidth. This second generation high bandwidth memory is twice as fast as the first generation DRAM package and seven times faster than the GDDR5 DRAM chips. All this comes with two times the power efficiency.
Not only this, Samsung has also pointed out that it aims to produce similar 8 GB DRAM module within this year using the HBM2 that will provide the same services as the GDDR5 RAM but occupying 95% less space that will lay the path for super graphic cards that will have a small footprint.
“By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies,” said Sewon Chun, senior vice president or Memory Marketing at Samsung. “Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market.”
this Samsung chip will help the graphic hardware manufacturers such as AMD and NVidia to produce GPU’s with accelerated performance that also consumes significantly less powers. This will be important for devices that run on battery like the laptop pcs.
